Imbera in Semiconductor International 3/3/2010

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Embedded Die Technology Gains Support

Semiconductor International released an article about embedded die technologies on 3rd March, 2010.

"Embedded die technology is heading for volume production and may give fan-in wafer-level packaging a run for its money, predicts Yole Développement analyst Jerôme Baron. "Embedding dies into PCB laminates is another key piece of the widening 3-D packaging toolbox," Baron said."
see the whole article here

Semiconductor International 3/3/2010
Sally Cole Johnson, Contributing Editor

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